Title :
High reliability pre-mold package with optical fiber guide pipe
Author :
Tanahashi, Shigeo ; Matsubara, Takahiro
Author_Institution :
R&D Centre Keihanna, KYOCERA Corp., Kyoto, Japan
Abstract :
A pre-mold package with optical fiber guide pipe has been developed to supply the low cost package for the access network systems market. This paper describes the PD module utilizing the premold package which has a very low variation of dark current after the reliability test. It is very close to that of TO-CAN type PD. In this paper, we propose the premold package to meet the market requirements offering low cost and high reliability solution
Keywords :
modules; photodiodes; semiconductor device packaging; semiconductor device reliability; PD module; access network systems; cost; dark current; optical fiber guide pipe; pre-mold package; reliability; Capacitance measurement; Ceramics; Costs; Dark current; Electronics packaging; Lead; Optical fibers; Organic materials; Resins; Telecommunication network reliability;
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5231-9
DOI :
10.1109/ECTC.1999.776338
