DocumentCode :
2937775
Title :
Post-weld-shift in semiconductor laser packaging
Author :
Wang, Stanley C. ; Chang, H.L. ; Wang, Chingyue ; Wang, C.M. ; Liaw, J.W. ; Sheen, M.T. ; Kuang, J.H. ; Chien, C.P. ; Wang, G.L. ; Cheng, W.H.
Author_Institution :
Chunghwa Telecom Labs
fYear :
1999
fDate :
1-4 June 1999
Firstpage :
1159
Lastpage :
1163
Keywords :
Electronics packaging; Fiber lasers; Finite element methods; Laser beams; Laser modes; Optical materials; Semiconductor device packaging; Semiconductor lasers; Structural beams;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA, USA
ISSN :
0569-5503
Print_ISBN :
0-7803-5231-9
Type :
conf
DOI :
10.1109/ECTC.1999.776341
Filename :
776341
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2937775
