Title :
A micropower biomedical signal processor for mobile healthcare applications
Author :
Hsu, Shu-Yu ; Chen, Yao-Lin ; Chang, Po-Yao ; Yu, Jui-Yuan ; Yang, Ten-Fang ; Chen, Ray-Jade ; Lee, Chen-Yi
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Abstract :
This work presents a biomedical signal processor (BSP) with hybrid functional cores to optimize the power dissipation and system flexibility for mobile healthcare applications. Embedded with the biomedical core and a 32-bit RISC core, multi-features are extracted for classification and the abnormal data are compressed. In addition, the crypto core secures both the data and wireless link protocols to protect the user privacy. This BSP chip is fabricated in a 90nm standard CMOS technology with core area of 1.17mm2. To overcome the leakage in advanced technology, a duty-cycled clock generator minimizes the system active duty and the inactive functions are power gated. Operating at 25MHz frequency and 0.5V supply voltage, the energy of RISC core is down to 3.44pJ/cycle. Accompanied with dedicated biomedical and crypto cores, the average BSP power achieves 38μW at 25MHz and 0.5/1.0V when performing the ECG alarm application.
Keywords :
CMOS digital integrated circuits; biomedical electronics; clocks; digital signal processing chips; electrocardiography; feature extraction; health care; medical signal processing; protocols; reduced instruction set computing; security of data; ECG alarm application; RISC core; biomedical core; cryptocore security; duty-cycled clock generator; feature extraction; frequency 25 MHz; hybrid functional core; micropower BSP; micropower biomedical signal processor; mobile healthcare application; power 38 muW; power dissipation; size 90 nm; standard CMOS technology; system flexibility; user privacy protection; voltage 0.5 V; voltage 1.0 V; wireless link protocol; word length 32 bit; Clocks; Electrocardiography; Elliptic curve cryptography; Feature extraction; Mobile communication; Reduced instruction set computing;
Conference_Titel :
Solid State Circuits Conference (A-SSCC), 2011 IEEE Asian
Conference_Location :
Jeju
Print_ISBN :
978-1-4577-1784-0
DOI :
10.1109/ASSCC.2011.6123572