DocumentCode :
2941287
Title :
Design and fabrication of low-cost PUMA arrays
Author :
Holland, Steven S. ; Vouvakis, Marinos N.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Massachusetts, Amherst, MA, USA
fYear :
2011
fDate :
3-8 July 2011
Firstpage :
1976
Lastpage :
1979
Abstract :
Measurements and simulations for various Planar Ultrawideband Modular Antenna (PUMA) arrays are presented. The arrays are based on tightly-coupled printed dipoles above a ground plane and are fully planar, where both the radiating aperture and feed lines are fabricated using low-cost multilayer PCB technology. The dipoles are fed with a novel feeding scheme that suppresses a catastrophic common-mode resonance, thus eliminating the use of feed organizers and external baluns. A product of this novel feeding is the modularity of the aperture (tiled assembly). A proof of concept 16×16×2 dual-polarized array prototype operating over 7-21.5GHz (3:1 bandwidth) was fabricated and measured. The results are in very good agreement with simulations, exhibiting a broadside VSWR = 2.1 and low (-15dB) cross-polarization in the diagonal plane out to 45°. Additionally, an infinite 5:1 PUMA design with broadside VSWR = 2.1, better than 2.9 VSWR at 45° in the H-plane, and cross-pol less than -15dB out to θ = 45° in the D-plane is presented.
Keywords :
antenna feeds; antenna radiation patterns; aperture antennas; dipole antenna arrays; microstrip antenna arrays; planar antenna arrays; printed circuits; resonance; ultra wideband antennas; broadside VSWR; catastrophic common mode resonance; diagonal plane; dual-polarized array prototype; feed line; ground plane; low cost PUMA array design; low cost PUMA array fabrication; low cost multilayer PCB technology; planar ultrawideband modular antenna array; radiating aperture; tightly-coupled printed dipole; Antenna arrays; Apertures; Bandwidth; Broadband antennas; Feeds; Impedance matching; Prototypes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Antennas and Propagation (APSURSI), 2011 IEEE International Symposium on
Conference_Location :
Spokane, WA
ISSN :
1522-3965
Print_ISBN :
978-1-4244-9562-7
Type :
conf
DOI :
10.1109/APS.2011.5996892
Filename :
5996892
Link To Document :
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