Title :
A 0.8V 64×64 CMOS imager with integrated sense-and-stimulus pixel for artificial retina applications
Author :
Lee, Chih-Lin ; Hsieh, Chih-Cheng
Author_Institution :
Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Abstract :
A 0.8V 64×64 CMOS Image Sensor (CIS) array with integrated sense-and-stimulus (SAS) pixel is presented in this paper. The in-pixel photon-to-biphasic-current converter (sense) and balanced current-mode stimulator (stimulus) are proposed to achieve a high integration and low power solution for high-resolution vision recovery. Two operation modes as programming (PG) mode and implanted (IP) mode are integrated in this design for multiple purposes. In PG mode, the output pattern of current stimulator array is programmable with external addresses for patterned electrical stimulus experiments of retina. In IP mode, the chip is fully functional with minimized number of I/O as 4 optimized for implant operation. A 64×64 SAS pixel array with 30×30 um2 pixel size has been designed and fabricated in TSMC 0.18um CIS technology. Measurement results show a 0.01uA/lux conversion gain and the maximum driving capability of biphasic neural stimulation current pulse is 10μA with a 10kΩ electrode model. It achieves the highest array resolution as 4096 pixels operated at 0.8V, 19.5fps, and 9.6mW.
Keywords :
CMOS image sensors; biomedical imaging; electrodes; image resolution; patient treatment; prosthetics; CIS array; CMOS image sensor array; IP mode; PG mode; TSMC CIS technology; artificial retina application; balanced current-mode stimulator; biphasic neural stimulation current pulse; current 10 muA; high-resolution vision recovery; implanted mode; in-pixel photon-to-biphasic-current converter; integrated SAS pixel; integrated sense-and-stimulus pixel; patient vision restoration; patterned electrical stimulus experiment; power 9.6 mW; programming mode; resistance 10 kohm; size 0.18 mum; voltage 0.8 V; Arrays; CMOS image sensors; Electrodes; Generators; IP networks; Programming; Retina;
Conference_Titel :
Solid State Circuits Conference (A-SSCC), 2011 IEEE Asian
Conference_Location :
Jeju
Print_ISBN :
978-1-4577-1784-0
DOI :
10.1109/ASSCC.2011.6123635