DocumentCode
2943702
Title
A novel capacitive absolute pressure sensor using SON technology
Author
Hao, X. ; Masuda, Atsushi ; Higuchi, Kenichi ; Tanaka, Shoji ; Maenaka, Kazusuke ; Takao, Hidekuni ; Nakamura, Jun ; Sudoh, Koichi
Author_Institution
Maenaka Human-Sensing Fusion Project, Japan Sci. & Technol. Agency (JST), Himeji, Japan
fYear
2012
fDate
28-31 Oct. 2012
Firstpage
1
Lastpage
4
Abstract
A novel capacitive absolute pressure sensor is fabricated and evaluated in this paper. The pressure sensitive membrane is formed by SON (Silicon on Nothing) technology [1], and a glass chip with Au/Ti electrodes is bonded on the membrane opposite by anodic bonding technique at 400°C to detect the pressure change. Compared to the existing capacitive absolute pressure sensors, the hermetical sealing process is not required, high vacuum cavity can be easily formed, an excellent long-term stability can be achieved, and detection circuitry can be easily integrated with the sensor.
Keywords
capacitive sensors; elemental semiconductors; gold; membranes; pressure sensors; silicon; titanium; SON technology; anodic bonding technique; capacitive absolute pressure sensor; detection circuitry; electrodes; glass chip; hermetical sealing process; long-term stability; pressure sensitive membrane; silicon on nothing technology; temperature 400 degC; Biomembranes; Bonding; Cavity resonators; Electrodes; Silicon; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2012 IEEE
Conference_Location
Taipei
ISSN
1930-0395
Print_ISBN
978-1-4577-1766-6
Electronic_ISBN
1930-0395
Type
conf
DOI
10.1109/ICSENS.2012.6411068
Filename
6411068
Link To Document