• DocumentCode
    2943702
  • Title

    A novel capacitive absolute pressure sensor using SON technology

  • Author

    Hao, X. ; Masuda, Atsushi ; Higuchi, Kenichi ; Tanaka, Shoji ; Maenaka, Kazusuke ; Takao, Hidekuni ; Nakamura, Jun ; Sudoh, Koichi

  • Author_Institution
    Maenaka Human-Sensing Fusion Project, Japan Sci. & Technol. Agency (JST), Himeji, Japan
  • fYear
    2012
  • fDate
    28-31 Oct. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A novel capacitive absolute pressure sensor is fabricated and evaluated in this paper. The pressure sensitive membrane is formed by SON (Silicon on Nothing) technology [1], and a glass chip with Au/Ti electrodes is bonded on the membrane opposite by anodic bonding technique at 400°C to detect the pressure change. Compared to the existing capacitive absolute pressure sensors, the hermetical sealing process is not required, high vacuum cavity can be easily formed, an excellent long-term stability can be achieved, and detection circuitry can be easily integrated with the sensor.
  • Keywords
    capacitive sensors; elemental semiconductors; gold; membranes; pressure sensors; silicon; titanium; SON technology; anodic bonding technique; capacitive absolute pressure sensor; detection circuitry; electrodes; glass chip; hermetical sealing process; long-term stability; pressure sensitive membrane; silicon on nothing technology; temperature 400 degC; Biomembranes; Bonding; Cavity resonators; Electrodes; Silicon; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2012 IEEE
  • Conference_Location
    Taipei
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4577-1766-6
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2012.6411068
  • Filename
    6411068