DocumentCode
2946872
Title
Simultaneous switching noise simulation for thin film packages using macromodeling technique
Author
Huang, Chender ; Celik, Mustafa ; Prince, John L.
Author_Institution
Arizona Univ., Tucson, AZ, USA
fYear
1996
fDate
28-31 May 1996
Firstpage
747
Lastpage
751
Abstract
This paper presents a fast and accurate methodology for Simultaneous Switching Noise (SSN) simulation for thin film packaging structures using a macro-modeling technique. The combination of interconnect macromodels and SPICE simulation for nonlinear drivers make this technique attractive for large SSN simulation. This technique results in one order of magnitude improvement in the simulation speed for SSN when compared with conventional SPICE run time
Keywords
SPICE; equivalent circuits; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; thin film circuits; SPICE simulation; interconnect macromodels; macromodeling technique; simultaneous switching noise simulation; thin film packages; Admittance; Circuit simulation; Costs; Driver circuits; Electronics packaging; Integrated circuit interconnections; SPICE; Semiconductor device noise; Switching circuits; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location
Orlando, FL
ISSN
0569-5503
Print_ISBN
0-7803-3286-5
Type
conf
DOI
10.1109/ECTC.1996.550490
Filename
550490
Link To Document