Optimum placement of decoupling capacitors on packages and printed circuit boards under the guidance of electromagnetic field simulation

This paper presents an efficient signal integrity analysis technique for simulating voltage fluctuations on power/ground planes in complex packaging structures. With its unique circuit and electromagnetic field solvers, the value, the number and the location of the decoupling capacitor placed on packages or printed circuit boards can be quickly and effectively evaluated. Examples are provided to demonstrate that how a good decoupling scheme is achieved under the guidance of electromagnetic field simulation