DocumentCode
2947563
Title
On the testing of the identity operator and the accuracy improvement of the second-kind SIEs
Author
Yan, Su ; Jin, Jian-Ming ; Nie, Zaiping
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Illinois at UrbanaUrbana-Champaign, Urbana, IL, USA
fYear
2011
fDate
3-8 July 2011
Firstpage
3185
Lastpage
3188
Abstract
Surface integral equations (SIEs) are widely used in the numerical analysis of electromagnetic wave scattering and radiation problems. However, the second-kind Fredholm integral equations are always found to produce less accurate numerical solutions than their first-kind counterparts. Among the variety of error sources, the discretization error due to the identity operator contributes the most. When the low-order basis functions, such as the Rao-Wilton-Glisson (RWG) basis functions, are used to expand the unknown current densities, the Galerkin´s testing introduces a significant error in the solution. In this paper, the Buffa-Christiansen (BC) functions are shown to be a better testing function than the RWG function in the context of the method of weighted residuals (MWR). By using the BC as the testing functions, the numerical error of the identity operator, as well as that of the second-kind integral equations, are suppressed dramatically. Several numerical examples are given to demonstrate the accuracy improvement in both perfect electric conductor and dielectric scattering cases.
Keywords
Fredholm integral equations; Galerkin method; electromagnetic wave scattering; Buffa-Christiansen functions; Galerkin testing; Rao-Wilton-Glisson basis functions; electromagnetic wave radiation; electromagnetic wave scattering; identity operator testing; low-order basis functions; method of weighted residuals; numerical analysis; second-kind Fredholm integral equations; second-kind SIE; surface integral equations; Impedance; Impedance measurement; Surface impedance; Testing; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation (APSURSI), 2011 IEEE International Symposium on
Conference_Location
Spokane, WA
ISSN
1522-3965
Print_ISBN
978-1-4244-9562-7
Type
conf
DOI
10.1109/APS.2011.5997210
Filename
5997210
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