Advanced process control for nano technology manufacturing

Currently, inline metrology and tool FDC data are the main information source which engineers use to conduct the process control. However, metrology data are very expensive in terms of their tool cost and its hit on cycle time. Moreover, metrology measurement accuracy is increasingly questionable due to the rapid device shrinking factor. All leading fabs are employing EES/FDC system to provide real time information of the wafer status for feedback, control and process optimization. However, they are expensive to setup and maintain due to its high IT infrastructure and human monitoring cost. They are also prone to frequent missing and false alarms. In this discussion, we will address potential solutions for more effective process control in the maga fabs. We believe, a new generation of advance process control system is required for all new generation fabs: · We will need a more effective fab wide EES/FDC network. Rather than monitor process on a single tool and recipe base, we need to monitor the whole process flow on a holistic base and achieve product performance/yield relevant process control. This methodology will require centrally controlled tool data collection, analysis and monitor. EES/YMS data integration and correlation will enable performance/yield focused tool control by dynamically control the key process in the whole process. Given the shrinking process margin in nano manufacturing, we will require more items to be monitored on a regular basis. Our expectation is a combination of in-line and EOL characterization and model-based process control & diagnostics. Inline virtual metrology based on physical model is required to greatly enhance the metrology practice and provide data source for dynamic process control like R2R. The electronics industry is becoming one of the most capital-intensive industries. A well designed fab-wide control framework provides improved competitiveness of the manufacturers as they transition to nano scale manufactu ring. This transition provides exciting challenges and opportunities to engineers to develop a new process control paradigm for the industry.