DocumentCode
2952066
Title
MRI compatibility of microfabricated magnetic actuators for implantable catheters: Mechanical evaluations
Author
Lee, Hyowon ; Xu, Qing ; Ephrati, Jeremy ; Bergsneider, Marvin ; Judy, Jack W.
Author_Institution
Biomed. Eng. Interdept. Program, Univ. of California, Los Angeles, CA, USA
fYear
2010
fDate
Aug. 31 2010-Sept. 4 2010
Firstpage
907
Lastpage
910
Abstract
Here we demonstrate the mechanical robustness of microfabricated torsional magnetic actuators in withstanding the magnetic fields produced by a 7 T MRI magnet. The static and dynamic mechanical characteristics of 30 devices were quantitatively measured before and after exposure to both uniform and non-uniform magnetic fields. The results show no statistically significant change in both the static and dynamic mechanical performance, which mitigates concerns about the mechanical compatibility of our devices with MRI scanners. Additional experiments are required to quantify the potential image-artifact size and radio-frequency-induced heating caused by the magnetic microactuators inside an MRI scanner.
Keywords
biomagnetism; biomedical MRI; catheters; electromagnetic actuators; electromagnetic compatibility; microfabrication; micromechanical devices; optical scanners; prosthetics; 7 T MRI magnet; MRI compatibility; MRI scanners; image-artifact size; implantable catheters; magnetic microactuators; mechanical compatibility; mechanical evaluation; mechanical robustness; microfabricated magnetic actuator; microfabricated torsional magnetic actuators; nonuniform magnetic fields; radio-frequency-induced heating; uniform magnetic fields; Magnetic devices; Magnetic resonance imaging; Magnetomechanical effects; Magnetostatics; Micromagnetics; Stress; Torque; Catheters, Indwelling; Equipment Design; Equipment Failure Analysis; Magnetic Resonance Imaging; Magnetics; Miniaturization; Reproducibility of Results; Sensitivity and Specificity; Transducers;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2010 Annual International Conference of the IEEE
Conference_Location
Buenos Aires
ISSN
1557-170X
Print_ISBN
978-1-4244-4123-5
Type
conf
DOI
10.1109/IEMBS.2010.5627830
Filename
5627830
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