• DocumentCode
    2954074
  • Title

    GSNOC UI — A comfortable graphical user interface for advanced design and evaluation of 3-dimensional scalable Networks-on-Chip

  • Author

    Gottschling, Philip ; Ying, Haoyuan ; Hofmann, Klaus

  • Author_Institution
    Integrated Electron. Syst. Lab., Darmstadt Univ. of Technol., Darmstadt, Germany
  • fYear
    2012
  • fDate
    2-6 July 2012
  • Firstpage
    261
  • Lastpage
    267
  • Abstract
    3D integrated circuit (IC) technology can be applied to the already known 2D Network-on-Chip (NoC) approach for System-on-Chips (SoCs). This resulting new approach brings advantages like higher integration density and better performance but also raises the question when the higher implementation costs are really profitable. To answer this question, for a lot of different cases, a framework was developed for simulating 3-dimensional (3D) NoCs, which provides results that are close to real applications and implementations. The framework is highly adaptable in terms of traffic scenarios, available memory, network size (including manual Through-Silicon-VIA (TSV) settings), routing algorithm, chip size and implementation technology. As the complexity of this framework increased in both, environment setup and available information, it was decided to build a graphical user interface (GUI) for an easy access to it. This user interface consists of a lucid configuration interface for generating the traffic scenarios and adjusting all necessary parameters for running a successful simulation. It further provides a front-end for observing the network during the running simulation. To give the user a good notion about the networks behavior, information about the processing elements (PEs) current state, the buffer utilization and the link utilization is displayed in a 2-dimensional (2D) and 3D model of the network. To check if predefined conditions to the energy budget and distributed memory demands are met, an automatically generated post simulation report summarizes all the gained information. This report includes the systems configuration, the buffer fill level, interconnect energy consumption and link utilization for each node and in total.
  • Keywords
    graphical user interfaces; network-on-chip; 2D network-on-chip; 3D NoC; 3D integrated circuit technology; 3D model; 3D scalable network-on-chip; GSNOC UI; advanced design; buffer fill level; buffer utilization; comfortable graphical user interface; distributed memory demand; gained information; integration density; interconnect energy consumption; link utilization; lucid configuration interface; network behavior; network size; processing element; routing algorithm; system-on-chip; through silicon VIA; traffic scenario; Benchmark testing; Energy consumption; Generators; Graphical user interfaces; Manuals; Routing; Solid modeling; 3D Network-on-Chip; Energy; Evaluation; Graphical User Interface; Performance; Simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Performance Computing and Simulation (HPCS), 2012 International Conference on
  • Conference_Location
    Madrid
  • Print_ISBN
    978-1-4673-2359-8
  • Type

    conf

  • DOI
    10.1109/HPCSim.2012.6266922
  • Filename
    6266922