DocumentCode :
2957065
Title :
Requirements and challenges for lithography...beyond 193 nm optics
Author :
Canning, John
Author_Institution :
SEMATECH, Austin, TX, USA
fYear :
1998
fDate :
23-26 Mar 1998
Firstpage :
25
Lastpage :
28
Abstract :
The growth of the semiconductor industry is driven by steady advances in microlithography. The Semiconductor Industry Association (SIA) Roadmap has been revised for 1997 with accelerated requirements. The 180 nm generation has been pulled in two years from 2001 to 1999. Subsequent generations have all been accelerated by one year. In addition, the Roadmap is now driven by microprocessor needs. The minimum feature size (MFS) is now the isolated line of a microprocessor gate, and it is approximately 75% of the generation size. Optical lithography is reaching its cost-effective limits near 130 nm. The next generation lithography (NGL) must be available by 2003 for pilot production, but the path to get there is not clear. In order to meet the needs of its members, SEMATECH has embarked on a program to explore and reach a global consensus on the technology options on the Roadmap for NGL. This paper reviews the revised SIA Roadmap and its implications for the semiconductor industry for smaller feature sizes, larger chip sizes and new technologies. The paper also reviews the status of the SEMATECH program to reach consensus on NGL, including the critical issues for each technology
Keywords :
electron beam lithography; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; microprocessor chips; photolithography; planning; 130 nm; 180 nm; 193 nm; IC generation size; SIA Roadmap; Semiconductor Industry Association; chip size; deep UV optics; feature size; isolated line; lithography; microlithography; microprocessor; microprocessor gate; minimum feature size; optical lithography; optical lithography cost-effective limits; pilot production; semiconductor industry; Acceleration; Canning; Lithography; Microelectronics; Microprocessors; Productivity; Shipbuilding industry; Testing; USA Councils; Ultraviolet sources;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronic Test Structures, 1998. ICMTS 1998., Proceedings of the 1998 International Conference on
Conference_Location :
Kanazawa
Print_ISBN :
0-7803-4348-4
Type :
conf
DOI :
10.1109/ICMTS.1998.688029
Filename :
688029
Link To Document :
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