Title :
Thyratron modulators in plasma source ion implantation
Author :
Adler, R.J. ; Scheuer, J. ; Horne, W.
Author_Institution :
North Star Res. Corp., USA
Abstract :
Plasma source ion implantation (PSII) is an emerging technology which can be used to harden metal surfaces in a conformal manner. North Star Research Corp. (NSRC) is building a unique implanter system for Empire Hard Chrome which will be the first truly commercial implanter of this type. The choice of pulsed power technology for this application is important from the standpoint of both reliability and compatibility with the basic plasma processes under consideration. In this paper, the authors evaluate the various possible pulsed power system choices including thyratron modulators, hard tube modulators and crossatron modulators in the context of compatibility with the plasma and implantation process. Currents in the hundreds of amperes at 80-100 kV are clearly found to be desirable based on the requirements of the process. This leads to the logical choice of thyratron/transformer modulators at lower average powers, or crossatron modulators at higher average powers. They also discuss pulse forming network design for thyratron modulators for the universal PSII-type waveform. A thyratron modulator was selected for the Empire implanter due to the requirements for low cost and high peak current.
Keywords :
ion implantation; modulators; plasma applications; power supplies to apparatus; pulse generators; pulsed power technology; surface hardening; 80 to 100 kV; compatibility; crossatron modulators; hard tube modulators; metal surface hardening; plasma source ion implantation; pulse forming network; pulsed power supplies; reliability; thyratron modulators; transformer modulators; Industrial power systems; Ion implantation; Plasma applications; Plasma immersion ion implantation; Plasma sources; Power system reliability; Pulse modulation; Pulse power systems; Pulse transformers; Thyratrons;
Conference_Titel :
Pulsed Power Conference, 1995. Digest of Technical Papers., Tenth IEEE International
Conference_Location :
Albuquerque, NM, USA
Print_ISBN :
0-7803-2791-8
DOI :
10.1109/PPC.1995.599786