DocumentCode :
2963208
Title :
Design, development and application of an object oriented simulation toolkit for real-time semiconductor manufacturing scheduling
Author :
Chin Soon Chong
Author_Institution :
Gintic Inst. of Manuf. Technol., Nanyang Technol. Univ., Singapore, Singapore
Volume :
2
fYear :
2002
fDate :
8-11 Dec. 2002
Firstpage :
1849
Abstract :
Real-time scheduling of semiconductor manufacturing operations, semiconductor test operations in particular, is complicated due to the following factors; multi-head resources, multi-level hardware dependency, temperature and hardware criteria, dynamic determination of processing time and indexing time, batch processing and re-entrant flow. A first-of-its-kind, object oriented (OO), discrete event simulation (DES) toolkit, RTMSim++ for real-time simulation-based scheduling applications has been conceptualized, designed, developed to resolve real-time scheduling problems in manufacturing. This paper reviews the work done in the development of RTMSim++ toolkit, and a case study in a real-time scheduling application. The salient features of the toolkit includes flexibility to customize and extend its functionality, real time shop floor status data initialization, and capability for modeling complex resource and process relationships. In the case study, RTMSim++ has been customized to incorporate very company specific heuristic rules, with the objectives of improving delivery performance, equipment utilization and cycle time.
Keywords :
discrete event simulation; manufacturing data processing; object-oriented methods; production control; real-time systems; scheduling; semiconductor device manufacture; RTMSim++ toolkit; batch processing; discrete event simulation; equipment utilization; heuristic rules; multi-level hardware dependency; object oriented simulation toolkit; real time shop floor status data; real-time semiconductor manufacturing scheduling; semiconductor test operations; Discrete event simulation; Dynamic scheduling; Hardware; Job shop scheduling; Manufacturing processes; Object oriented modeling; Semiconductor device manufacture; Semiconductor device testing; Temperature dependence; Virtual manufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation Conference, 2002. Proceedings of the Winter
Print_ISBN :
0-7803-7614-5
Type :
conf
DOI :
10.1109/WSC.2002.1166478
Filename :
1166478
Link To Document :
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