Toward a real system integration; A direction of IC technology

Author

Matsuzawa, Akira

Author_Institution

Tokyo Inst. of Technol., Tokyo

fYear

2007

fDate

4-6 June 2007

Firstpage

75

Lastpage

77

Abstract

A direction of IC technology is discussed with relation to mixed signal and interconnects technology for realizing real system integration. IC technology has progressed from an integration of simple digital circuits to an integration of increasingly complicated circuits and devices. Mixed signal technology is currently widely used for SoCs to compensate damage of externally received signals. In CMOS RF circuit technology coping with the size of on-chip inductor technology is vital for many SoCs for wireless systems. Millimeter wave communication will realize Giga-bit wireless data transfer and requires interesting new IC technologies such as a transmission line and an on-chip antenna technology. Transmission of electric power to chips will be an important future IC technology for fine-grained power management systems and ubiquitous systems.

Keywords

CMOS integrated circuits; integrated circuit interconnections; millimetre wave integrated circuits; mixed analogue-digital integrated circuits; power integrated circuits; system-on-chip; CMOS RF circuit technology; IC technology; SoC; digital circuits; fine-grained power management systems; giga-bit wireless data transfer; interconnects technology; millimeter wave communication; mixed signal technology; on-chip antenna technology; on-chip inductor technology; real system integration; transmission line; ubiquitous systems; CMOS technology; Digital circuits; Digital integrated circuits; Inductors; Integrated circuit interconnections; Millimeter wave communication; Millimeter wave technology; Power transmission lines; Radio frequency; System-on-a-chip;

fLanguage

English

Publisher

ieee

Conference_Titel

International Interconnect Technology Conference, IEEE 2007

Conference_Location

Burlingame, CA

Print_ISBN

1-4244-1069-X

Electronic_ISBN

1-4244-1070-3

Type

conf

DOI

10.1109/IITC.2007.382353

Filename

4263665