DocumentCode :
2964094
Title :
The Delay, Energy, and Bandwidth Comparisons between Copper, Carbon Nanotube, and Optical Interconnects for Local and Global Wiring Application
Author :
Cho, Hoyeol ; Koo, Kyung-Hoae ; Kapur, Pawan ; Saraswat, Krishna C.
Author_Institution :
Center of Integrated Syst., Stanford
fYear :
2007
fDate :
4-6 June 2007
Firstpage :
135
Lastpage :
137
Abstract :
The interconnect bottleneck presents a compelling reason to explore novel interconnect architectures. We compare two promising interconnects: carbon nanotube (CNT) and optical, with traditional Cu/low-K wires. We find that the optical wires yield the lowest latency and the highest bandwidth density. However, in terms of a system´s top- down, novel, metric-bandwidth density per latency per power, CNTs can yield comparable performance to optical wires provided a certain mean free path and packing density is achieved. We quantify these technology parameters and also examine the impact of CNT diameter and bundle width on the performance comparison with Cu/low-K.
Keywords :
carbon nanotubes; copper; delays; optical interconnections; Cu/low-K wires; bandwidth characteristic; carbon nanotube; delay characteristic; energy characteristic; global wiring; local wiring; mean free path; optical interconnects; optical wires; packing density; Bandwidth; Carbon nanotubes; Copper; Inductance; Optical interconnections; Optical transmitters; Optical waveguides; Propagation delay; Wire; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
International Interconnect Technology Conference, IEEE 2007
Conference_Location :
Burlingame, CA
Print_ISBN :
1-4244-1069-X
Electronic_ISBN :
1-4244-1070-3
Type :
conf
DOI :
10.1109/IITC.2007.382375
Filename :
4263687
Link To Document :
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