DocumentCode
2964795
Title
Silicon photonic devices and their integration
Author
Ohashi, Keishi
Author_Institution
Nano Electron. Res. Labs., NEC Corp., Tsukuba
fYear
2008
fDate
2-15 Aug. 2008
Firstpage
55
Lastpage
55
Abstract
Optical communication is accepted as practical when the cost of introducing it is less than that of the conventional electronics. Silicon photonics is the prime candidates for low-cost highly integrated photonic devices because silicon semiconductor industry gives the most cost-effective and highly-integrated devices today. In addition to that, silicon as an optical material offers high-index contrast waveguides and hence it gives micro-meter scale passive optical devices. Those advantages could lead silicon photonics as a key technology for shorter interconnects such as on-chip networks as well as for long-haul telecommunication devices. Low cost integration of photonics with LSI using 3D-integration and surface-plasmon devices will be discussed briefly.
Keywords
elemental semiconductors; integrated optics; optical communication equipment; optical waveguides; silicon; surface plasmons; 3D-integration; high-index contrast waveguides; highly-integrated devices; low-cost highly integrated photonic devices; on-chip networks; optical communication; optical material; silicon photonic devices; silicon semiconductor industry; surface-plasmon devices; Costs; Electronics industry; Network-on-a-chip; Optical devices; Optical fiber communication; Optical materials; Optical waveguides; Photonics; Semiconductor waveguides; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano-Optoelectronics Workshop, 2008. i-NOW 2008. International
Conference_Location
Shonan Village
Print_ISBN
978-1-4244-2656-0
Type
conf
DOI
10.1109/INOW.2008.4634437
Filename
4634437
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