• DocumentCode
    2964795
  • Title

    Silicon photonic devices and their integration

  • Author

    Ohashi, Keishi

  • Author_Institution
    Nano Electron. Res. Labs., NEC Corp., Tsukuba
  • fYear
    2008
  • fDate
    2-15 Aug. 2008
  • Firstpage
    55
  • Lastpage
    55
  • Abstract
    Optical communication is accepted as practical when the cost of introducing it is less than that of the conventional electronics. Silicon photonics is the prime candidates for low-cost highly integrated photonic devices because silicon semiconductor industry gives the most cost-effective and highly-integrated devices today. In addition to that, silicon as an optical material offers high-index contrast waveguides and hence it gives micro-meter scale passive optical devices. Those advantages could lead silicon photonics as a key technology for shorter interconnects such as on-chip networks as well as for long-haul telecommunication devices. Low cost integration of photonics with LSI using 3D-integration and surface-plasmon devices will be discussed briefly.
  • Keywords
    elemental semiconductors; integrated optics; optical communication equipment; optical waveguides; silicon; surface plasmons; 3D-integration; high-index contrast waveguides; highly-integrated devices; low-cost highly integrated photonic devices; on-chip networks; optical communication; optical material; silicon photonic devices; silicon semiconductor industry; surface-plasmon devices; Costs; Electronics industry; Network-on-a-chip; Optical devices; Optical fiber communication; Optical materials; Optical waveguides; Photonics; Semiconductor waveguides; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano-Optoelectronics Workshop, 2008. i-NOW 2008. International
  • Conference_Location
    Shonan Village
  • Print_ISBN
    978-1-4244-2656-0
  • Type

    conf

  • DOI
    10.1109/INOW.2008.4634437
  • Filename
    4634437