• DocumentCode
    2965852
  • Title

    Assembly of III–V microdisk lasers on silicon using lateral-field optoelectronic tweezers

  • Author

    Ohta, Aaron T. ; Tien, Ming-Chun ; Neale, Steven L. ; Yu, Kyoungsik ; Wu, Ming C.

  • Author_Institution
    Univ. of California, Berkeley, CA
  • fYear
    2008
  • fDate
    2-15 Aug. 2008
  • Firstpage
    181
  • Lastpage
    182
  • Abstract
    A room-temperature optofluidic assembly process to integrate III-V microdisk lasers on a silicon chip is demonstrated. The assembly is accomplished using lateral-field optoelectronic tweezers, which achieves a placement accuracy of approximately plusmn 0.25 mum.
  • Keywords
    III-V semiconductors; integrated optics; radiation pressure; semiconductor lasers; III-V microdisk lasers; lateral-field optoelectronic tweezers; room-temperature optofluidic assembly process; silicon chip; Assembly; Biomedical optical imaging; Electrodes; III-V semiconductor materials; Optical pumping; Optical scattering; Pump lasers; Semiconductor laser arrays; Semiconductor lasers; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano-Optoelectronics Workshop, 2008. i-NOW 2008. International
  • Conference_Location
    Shonan Village
  • Print_ISBN
    978-1-4244-2656-0
  • Type

    conf

  • DOI
    10.1109/INOW.2008.4634500
  • Filename
    4634500
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2965852