• DocumentCode
    2969
  • Title

    HTS Insert Cryostat Integrated With Conduction-Cooled Superconducting Magnet for High Magnetic Field Applications

  • Author

    Yeon Suk Choi ; Dong Lak Kim ; Myung Su Kim

  • Author_Institution
    Korea Basic Sci. Inst., Daejeon, South Korea
  • Volume
    23
  • Issue
    3
  • fYear
    2013
  • fDate
    Jun-13
  • Firstpage
    4601604
  • Lastpage
    4601604
  • Abstract
    The Korea Basic Science Institute has been developing a 5-T high temperature superconducting (HTS) insert magnet system. The objective of the program is the design and fabrication of an HTS insert magnet system for high-field superconducting magnet applications. Because the HTS magnet system should be inserted into the conduction-cooled 15 T background magnet with 102-mm room-temperature bore, several ancillary requirements such as space restriction and cryostat structure need technical attention. In this paper, the design of the HTS insert cryostat for 5 T HTS coil is presented. The design process of the novel cryostat to overcome the cryogenic space restriction is described, taking into account the dimension of the HTS coil, cryogenic loads, and inventory of cryogen. The structure of the vessel, considering support structure and thermal path, is also described. In addition, the fabrication of the insert cryostat is briefly presented.
  • Keywords
    cryostats; high-temperature superconductors; superconducting magnets; 5-T high temperature superconducting insert magnet system; HTS insert cryostat; Korea Basic Science Institute; conduction-cooled superconducting magnet; cryogenic space restriction; cryostat structure; high magnetic field applications; size 102 mm; temperature 293 K to 298 K; Coils; Helium; High temperature superconductors; Liquids; Magnetic noise; Magnetic shielding; Superconducting magnets; Cryostat; high temperature superconductors; insert magnet; thermal radiation;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2013.2238282
  • Filename
    6407799