Title :
2000 IEEE International Integrated Reliability Workshop Final Report (Cat. No.00TH8515)
Abstract :
The following topics were dealt with: wafer-level reliability testing; dielectric reliability; gate oxide reliability; IC circuit fabrication; electromigration; burn-in testing; non-volatile memories; failure analysis; MEMS reliability; time-dependent dielectric breakdown
Keywords :
reliability; IC circuit fabrication; MEMS reliability; burn-in testing; dielectric reliability; electromigration; failure analysis; gate oxide reliability; nonvolatile memories; reliability; time-dependent dielectric breakdown; wafer-level testing;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2000 IEEE International
Conference_Location :
Lake Tahoe, CA, USA
Print_ISBN :
0-7803-6392-2
DOI :
10.1109/IRWS.2000.911889
