Title :
A versatile pick and place tool for ultraprecise placement-demonstrated by the application in an advanced MCM-D technology
Author :
Guide, P. ; Bornholdt, O. ; Neumann, Gerold
Author_Institution :
Fraunhofer-Inst. fur Siliziumtechnol. ISIT, Itzehoe, Germany
Abstract :
Multichip modules for high performance applications are mostly realized in the MCM-D technology and have to satisfy a number of different requirements. Therefore new MCM-D techniques are still under development. A newly developed MCM-D approach based on chip-first technology is presented that is addressed to high-frequency systems as well as to highest interconnect densities. This development includes the set-up of a high precision pick and place tool, that allows the placing of chips with an accuracy of better than 5 μm. The set-up and the operation of this tool are described in detail
Keywords :
integrated circuit manufacture; microassembling; multichip modules; advanced MCM-D technology; chip placement; chip-first technology; high interconnect densities; high-frequency systems; multichip modules; pick and place tool; ultraprecise placement; Contacts; Dielectric substrates; Dielectric thin films; Electronic components; Frequency; Manufacturing; Metallization; Nonhomogeneous media; Silicon; Wet etching;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3929-0
DOI :
10.1109/IEMT.1997.626874
