Advanced solder bumping technology through super solder

Author

Hikasa, Kazuhito ; Irie, Hisao

Author_Institution

Furukawa Electr. Co. Ltd., Yokohama, Japan

fYear

1997

fDate

13-15 Oct 1997

Firstpage

48

Lastpage

55

Abstract

Furukawa Electric has developed method of eluding high-purity solder directly onto fine-pitch contacts through lattice substitution, called Super Solder (SS). The technology has already been adopted in precoating for boards mounting Pentium chips. SS supplies solder to fine-pitch electrode pads through a very simple process consisting of paste coat and heating, and is well suited to the needs of bump formation, especially on boards. This paper covers the configuration and characteristics of a production line providing fully-automatic bump formation with high yield, low labor requirements, and at a low capital investment

Keywords

fine-pitch technology; flip-chip devices; multichip modules; printed circuit manufacture; soldering; Furukawa Electric; fine-pitch contacts; flip-chip mounting; fully-automatic bump formation; high-purity solder; lattice substitution; paste coating; paste heating; production line; solder bumping technology; super solder technology; Character generation; Composite materials; Electrodes; Extraterrestrial measurements; Manufacturing; Powders; Printing; Volume measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-3929-0

Type

conf

DOI

10.1109/IEMT.1997.626875

Filename

626875