Title :
Ground connection soldering techniques of high density ceramics substrate of transmit/receive module and its reliability
Author :
Tingyue, Wang ; Dianheng, Cui ; Yu Shenlin ; Jun, Tang ; Wei, Yan
Author_Institution :
Nanjing Res. Inst. of Electron. Technol., China
Abstract :
The operation frequency of Transmit/Receive (T/R) module for active phased-array radar is very high (at least above 1000 MHz). The ground connection between the back side metal plating of the functional elements and the substrate carrier of the T/R module is so important that it can directly affect the performance and reliability of the functional elements and T/R module. In this paper, the following techniques are studied: conduction and reliability of the via hole between top side and back side of the thin film or thick film microwave circuit substrate, control of soldering stress and deformations; solderability of available materials; and soldering processing technology. Highly reliable T/R modules are successfully manufactured by using soldering in place of screws
Keywords :
integrated circuit reliability; microwave integrated circuits; phased array radar; soldering; thick film circuits; thin film circuits; transceivers; active phased-array radar; back side metal plating; ground connection soldering techniques; high density ceramics substrate; microwave circuit substrate; reliability; solderability; soldering processing technology; soldering stress; substrate carrier; thick film microwave circuit; thin film microwave circuit; transmit/receive module; via hole; Ceramics; Frequency; Materials reliability; Microwave theory and techniques; Radar; Soldering; Substrates; Thick film circuits; Thick films; Thin film circuits;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3929-0
DOI :
10.1109/IEMT.1997.626928
