Title :
Adhesive flip chip assembly using plated bump chips
Author :
Riley, George A.
Author_Institution :
HyComp Inc., Marlborough, MA, USA
Abstract :
While research on adhesive flip chip interconnection is growing rapidly, there has been little information available about how to apply this research to making practical adhesive flip chip assemblies. This paper describes two techniques- stenciled adhesive assembly, and dipped adhesive assembly- of the several available for flip chip interconnections between chip and substrate. Key features and differences of the two methods are discussed and illustrated with examples. The relative advantages, disadvantages, and limitations of the two methods are compared
Keywords :
adhesion; flip-chip devices; integrated circuit interconnections; integrated circuit manufacture; microassembling; printed circuit manufacture; soldering; adhesive flip chip assembly; dipped adhesive assembly; flip chip interconnection; plated bump chips; stenciled adhesive assembly; Assembly; Bonding; Conductive adhesives; Flip chip; Gold; Integrated circuit interconnections; Metallization; Nickel; Temperature; Testing;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3929-0
DOI :
10.1109/IEMT.1997.626937