Repeater insertion and wire sizing optimization for throughput-centric VLSI global interconnects

As technology advances towards billion transistor systems, the cost of complex wire networks will require area efficient wiring methodologies. This paper explores the tradeoffs between wire latency, throughput and area for deep submicron (DSM) interconnect technologies. From basic physical models, optimal wiring sizing for repeater networks are rigorously derived and compared to HSPICE simulations. Key case studies from 250 nm to 70 nm technologies reveal that significant wire area reduction (20-50%) can be achieved with optimal wire sizing to maximize the throughput per unit wire area.