• DocumentCode
    2979512
  • Title

    Schematic-based lumped parameterized behavioral modeling for suspended MEMS

  • Author

    Jing, Qi ; Mukherjee, Tridib ; Fedder, Gary K.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
  • fYear
    2002
  • fDate
    10-14 Nov. 2002
  • Firstpage
    367
  • Lastpage
    373
  • Abstract
    Schematic-based lumped parameterized behavioral modeling and simulation methodologies have become available since the emergence of analog HDLs. They greatly ease iterative hierarchical multi-domain simulation, which is critical to the design of MEMS. NODAS is one of such tools, with models written in VerilogA and simulation performed within the Cadence framework. This paper focuses on several key modeling issues in NODAS, including schematic representation, element communication, linear, nonlinear and multi-domain modeling, and extensibility to new physical effects, processes and physical domains. A nonlinear beam model and an electrostatic gap model are discussed as examples. Simulation comparison to finite element analyses and experimental data verifies the accuracy of the models and validates the simulation methodology.
  • Keywords
    digital simulation; electronic engineering computing; mechanical engineering computing; micromechanical devices; modelling; Cadence framework; NODAS tool; VerilogA; electrostatic gap model; element communication; iterative hierarchical multi-domain simulation; linear modeling; lumped parameterized behavioral modeling; multi-domain modeling; nonlinear beam model; nonlinear modeling; schematic representation; schematic-based behavioral modeling; suspended MEMS; Analog computers; Analytical models; Circuit simulation; Computational modeling; Design automation; Electrostatics; Hardware design languages; Micromechanical devices; Solid modeling; Space technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Aided Design, 2002. ICCAD 2002. IEEE/ACM International Conference on
  • ISSN
    1092-3152
  • Print_ISBN
    0-7803-7607-2
  • Type

    conf

  • DOI
    10.1109/ICCAD.2002.1167560
  • Filename
    1167560