Title :
Product-oriented BGA manufacturability and reliability study
Author :
Oberlin, B. ; Chung, Tom
Author_Institution :
Tandem Comput. Inc., Cupertino, CA, USA
Abstract :
Since 1993, many BGA board level manufacturability and reliability related papers have been published. Many of them were based on simple and non-product-oriented test boards. It is believed that a product-oriented BGA test vehicle design, assembled in a production environment, will provide more direct applicable information to BGA package users, and thus improve manufacturability and reliability of products utilizing BGA technology
Keywords :
lithography; manufacture; packaging; reliability; technological forecasting; testing5794829; BGA package; manufacturability; product-oriented test board; reliability; Assembly; Ceramics; Electric shock; Electronic equipment testing; Manufacturing; Modular construction; Plastic packaging; Production; Soldering; Vehicles;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3929-0
DOI :
10.1109/IEMT.1997.626944
