Title :
Compound Semiconductor as CMOS Channel Material: DéjÃ\xa0 vu or New Paradigm?
Author_Institution :
Dept. of Electr. Eng., Pennsylvania State Univ., University Park, PA
Abstract :
We have examined the potential of double gate (DG) inter-band tunnel FETs (TFET) in 3 different material systems, Si, Ge and InAs, for logic circuit applications down to 0.25 V supply voltage (VCC). Based on the two-dimensional numerical drift-diffusion simulations, we conclude that 30 nm gate length InAs (indium arsenide) based TFETs can achieve Ion/Ioff of > 4x104 with < 1 ps intrinsic delay at 0.25 V VCC. In fact, the InAs TFETs show the maximum benefit when their supply voltage VCC is scaled aggressively down to 0.25 V and this benefit primarily arises from a) efficient tunneling under low electric field and b) their higher source-side injection velocity. MOSFETs or quantum-well FETs in this low VDD range do not even meet the Ion-Ioff stipulation of 104.
Keywords :
CMOS integrated circuits; MOSFET; narrow band gap semiconductors; semiconductor quantum wells; tunnelling; CMOS channel material; MOSFET; TFET; double gate inter-band tunnel FETs; interband tunneling structure; logic circuit applications; nanoelectronics; narrow bandgap compound semiconductor based transistors; quantum-well FETs; quantum-well architecture; source-side injection velocity; supply voltage; two-dimensional numerical drift-diffusion simulations; ultralow power information processing; Circuit simulation; Delay; Double-gate FETs; Indium; Logic circuits; MOSFETs; Numerical simulation; Semiconductor materials; Tunneling; Voltage;
Conference_Titel :
Device Research Conference, 2008
Conference_Location :
Santa Barbara, CA
Print_ISBN :
978-1-4244-1942-5
Electronic_ISBN :
1548-3770
DOI :
10.1109/DRC.2008.4800724