• DocumentCode
    29823
  • Title

    Improved Performance of Ultrathin Cu(InGa)Se _{\\bf 2} Solar Cells With a Backwall Superstrate Configuration

  • Author

    Simchi, H. ; Larsen, Jan ; Kihwan Kim ; Shafarman, William

  • Author_Institution
    Inst. of Energy Conversion, Univ. of Delaware, Newark, DE, USA
  • Volume
    4
  • Issue
    6
  • fYear
    2014
  • fDate
    Nov. 2014
  • Firstpage
    1630
  • Lastpage
    1635
  • Abstract
    A backwall superstrate device structure that outperforms conventional substrate Cu(In,Ga)Se2 devices for thin absorbers is described. The backwall structure of glass/ITO/MoO3/Cu(In,Ga)Se2 /CdS/i-ZnO/Ag utilizes a MoO3 transparent back contact to allow illumination of the device from the back. The device performance has been improved by modifying the Cu(In,Ga)Se2, including alloying with Ag to form (AgCu)(InGa)Se2 absorber layers. In addition, sulfized back contacts including ITO-S and MoS2 are compared. Interface properties are discussed based on the XPS analysis and thermodynamics of reactions.
  • Keywords
    II-VI semiconductors; X-ray photoelectron spectra; cadmium compounds; copper compounds; free energy; gallium compounds; glass; indium compounds; interface structure; molybdenum compounds; silver; silver compounds; solar cells; ternary semiconductors; wide band gap semiconductors; zinc compounds; (AgCu)(InGa)Se2 absorber layer; ITO-S back contact; MoO3 transparent back contact; MoS2 back contact; SiO2-ITO-MoO3-AgCu(InGa)Se2-CdS-ZnO-Ag; XPS analysis; backwall superstrate device structure; device illumination; glass-ITO-MoO3-Cu(In,Ga)Se2-CdS-i-ZnO-Ag backwall structure; interface properties; reaction thermodynamics; sulfized back contact; ultrathin Cu(InGa)Se2 solar cell; Indium tin oxide; Passivation; Performance evaluation; Photovoltaic cells; Photovoltaic systems; Semiconductor materials; Substrates; Thin film devices; (AgCu)(InGa)Se2; backwall structure; solar cell; thin film; transparent back contact;
  • fLanguage
    English
  • Journal_Title
    Photovoltaics, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    2156-3381
  • Type

    jour

  • DOI
    10.1109/JPHOTOV.2014.2345436
  • Filename
    6879240