• DocumentCode
    2983113
  • Title

    Deposition of nanocrystalline copper oxide films for solar cell application

  • Author

    Wu, C.W. ; Wu, J.R. ; Chiang, M.J.

  • Author_Institution
    Southern Taiwan Univ., Tainan
  • fYear
    2007
  • fDate
    20-22 Dec. 2007
  • Firstpage
    673
  • Lastpage
    676
  • Abstract
    Nanocrystalline copper oxide films have been synthesized on glass by dc sputtering method. The effects of oxygen flow rate and deposition temperature on the microstructure of nanocrystalline copper oxide films were investigated. X-ray diffraction analysis shows that a broaden peak of Cu2O (111) was observed at the deposition condition of DC power 150 W, pressure 3.3 Pa, substrate temperature 200degC, Argon flow rate 10 seem and O2 flow rate 1 sccm. With increasing the oxygen flow rate to 3 - 5 and 7 sccm, CuO (-111) could be obtained at 100 and 200degC, respectively. The increase of oxygen flow rate resulted in the film formation from Cu2O to CuO. SEM pictures show that copper oxide films exhibit nanosize grains. X-ray diffraction patterns of CuO films deposited at 50-200degC show that only (-111) plane is obtained. The SEM pictures show that the grain size increases with the deposition increases.
  • Keywords
    X-ray diffraction; nanostructured materials; scanning electron microscopy; semiconductor growth; solar cells; sputter deposition; superconducting thin films; SEM pictures; X-ray diffraction analysis; dc sputtering method; nanocrystalline copper oxide film deposition; oxygen flow rate; power 150 W; solar cell application; temperature 50 degC to 200 degC; Argon; Copper; Glass; Grain size; Microstructure; Photovoltaic cells; Sputtering; Substrates; Temperature; X-ray diffraction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits, 2007. EDSSC 2007. IEEE Conference on
  • Conference_Location
    Tainan
  • Print_ISBN
    978-1-4244-0637-1
  • Electronic_ISBN
    978-1-4244-0637-1
  • Type

    conf

  • DOI
    10.1109/EDSSC.2007.4450215
  • Filename
    4450215