DocumentCode
2984508
Title
Interaction between thermal impedance and parasitics in power sections
Author
Förster, Stefan ; Lindemann, Andreas
Author_Institution
Otto-von-Guericke-Univ. Magdeburg, Magdeburg
fYear
2008
fDate
1-3 Sept. 2008
Firstpage
2420
Lastpage
2427
Abstract
Considerations refer to thermal optimisation and its coherence with the appearance of electrical parasitics in power electronic systems. Analytical and finite element simulation assisted analysis of thermal resistance depending on geometry of layered assemblies is discussed. Resulting approach provides a basis for considerations on parasitics applying partial element equivalent circuit method (PEEC).
Keywords
equivalent circuits; finite element analysis; power electronics; thermal analysis; thermal management (packaging); thermal resistance; finite element simulation; packaging system; partial element equivalent circuit method; power electronic systems; power section parasitics; thermal impedance; thermal optimisation; thermal resistance; Analytical models; Assembly; Circuit simulation; Electric resistance; Finite element methods; Geometry; Impedance; Power electronics; Solid modeling; Thermal resistance; Packaging; System Integration; Thermal Design;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics and Motion Control Conference, 2008. EPE-PEMC 2008. 13th
Conference_Location
Poznan
Print_ISBN
978-1-4244-1741-4
Electronic_ISBN
978-1-4244-1742-1
Type
conf
DOI
10.1109/EPEPEMC.2008.4635626
Filename
4635626
Link To Document