Title :
Performance characterization of a high density-low insertion force modular surface mount connector
Author_Institution :
Amphenol Corp., Sidney, NY, USA
Abstract :
It is considered that, in today´s high-density surface-mount-connector applications, the connector, contacts, and printed-circuit-board characteristics must be blended to provide a highly reliable mechanical and electrical system. Standard connector-evaluation sequences do not properly address the applications and needs of the high-density surface-mount-connector user. The paper presents evaluation sequences based on actual or intended usage of the connector and performance data to support the use of the Bendix bristle-brush contact in the particular high-performance connector system
Keywords :
electric connectors; modules; printed circuits; surface mount technology; Bendix bristle-brush contact; connector-evaluation sequences; high density-low insertion force modular surface mount connector; printed-circuit-board characteristics; Backplanes; Brushes; Connectors; Contacts; Design engineering; Electronics packaging; Ocean temperature; Reliability engineering; Sea surface; Temperature distribution;
Conference_Titel :
Aerospace and Electronics Conference, 1988. NAECON 1988., Proceedings of the IEEE 1988 National
Conference_Location :
Dayton, OH
DOI :
10.1109/NAECON.1988.195154
