• DocumentCode
    2987402
  • Title

    Temperature and Process Variations Aware Power Gating of Functional Units

  • Author

    Kannan, Deepa ; Shrivastava, Aviral ; Mohan, Vipin ; Bhardwaj, Sarvesh ; Vrudhula, Sarma

  • Author_Institution
    Arizona State Univ., Tempe
  • fYear
    2008
  • fDate
    4-8 Jan. 2008
  • Firstpage
    515
  • Lastpage
    520
  • Abstract
    Technology scaling has resulted in an exponential increase in the leakage power as well as the variations in leakage power of fabricated chips. Functional units (FUs), like Integer ALUs are regions of high power density and significantly contribute to the variation in the whole processor power consumption. Hence, it is important to reduce both the power consumption and the variation in power consumption of the FUs. Among existing FU power reduction techniques, power gating (PG) has been most effective. In this paper, we introduce a leakage sensor inside the FUs and propose a temperature and process variation aware power gating scheme, Leakage Aware Power Gating (LA-PG). Our experimental results demonstrate that LA-PG results in 22% reduction in mean and a 25% reduction in standard deviation of the ALU energy consumption when compared to existing power gating techniques, without significant performance penalty.
  • Keywords
    logic gates; low-power electronics; microprocessor chips; sensors; ALU energy consumption; functional units; leakage power; leakage sensor; process variations aware power gating; processor power consumption; technology scaling; temperature aware power gating scheme; Electronic design automation and methodology; Energy consumption; Informatics; Laboratories; Manufacturing; Microarchitecture; Power generation; Process design; Temperature sensors; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, 2008. VLSID 2008. 21st International Conference on
  • Conference_Location
    Hyderabad
  • ISSN
    1063-9667
  • Print_ISBN
    0-7695-3083-4
  • Type

    conf

  • DOI
    10.1109/VLSI.2008.83
  • Filename
    4450551