3M tribo-coating development and its application on microinterconnect flexible circuit

To develop a conductive polymer formulation which can be printed using an automated reel-to-reel process to form a thin film (0.1 to 25 /spl mu/m) on insulating materials. The materials can be but are not limited to, polymers, engineering plastic, ceramics, glasses, fibers, hard coating layers, especially on microinterconnect flexible circuits (1 to 10 mil in total thickness with or without organic cover, coating materials) Made from polyimide or Liquid crystal polymers (LCP) substrates. A thin conductive film will significantly reduce surface resistivity of the coated surfaces to a range of 10E5 to 10E9 ohms. The thickness of the film can be adjusted by the cliche design for pad printing with a dimensional alignment control of +/10-20%, or by the mesh design for screen-printing when there is a need in covering small features (200/spl mu/m). The printing process is a reel-to-reel high volume-manufacturing line.