Title :
New anisotropic conductive film (ACF)
Author :
Yokoyama, Akinori ; Maehara, Kazuo ; Takagi, Kazuo
Author_Institution :
LCT Project, Asahikasei Corporation, Shizuoka, Japan
Abstract :
Asahikasei has originally developed the new conductive powder AMG/sup R/ which has a specific structure mainly composed of copper and a small amount of silver, wherein its particle´s surface is quite rich in silver component in spite of containing a small amount of silver throughout the particle. The configuration of AMG are summarized here: (1) the Cu-Ag alloy powder is mainly composed of copper and a small amount of silver; (2) the particle surface is rich in silver component; (3) the shape is nearly spherical. Thanks to this specific structure, AMG shows excellent performance, such as high electroconductivity due to its composition of copper and silver, excellent reliability and less ion-migration because of its specific structure when applied to ACF.
Keywords :
circuit reliability; copper alloys; electrical conductivity; electromigration; electronics packaging; filled polymers; particle reinforced composites; silver alloys; AMG conductive powder; CuAg; anisotropic conductive film; copper-silver powder structure; electroconductivity; ion-migration; near-spherical shape; reliability; silver component-rich particle surface; Bonding; Conductive films; Conductivity; Contact resistance; Copper; Gold; Nickel; Powders; Shape memory alloys; Silver;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298744
