Highly accelerated stress test (HAST) for low-cost flip chip on board technology

Author

Wei, Jianzhong ; Wang, Qunyong ; Luo, Wen ; Xiao, Guowei ; Chan, Philip C. H.

Author_Institution

China Electron. Product Reliability & Environ. Testing Res. Inst., Guangzhou, China

fYear

2003

fDate

28-30 Oct. 2003

Firstpage

386

Lastpage

388

Abstract

Flip chip on board (FCOB) technology has been in widespread application. The reliability testing of solder-joints and the delamination between underfill and chip or substrate is still a critical issue for FCOB technology. In this paper, an accelerated environmental testing HAST-was used to rapidly evaluate the reliability of area array solder bumped packages on FR-4 PCBs. The test results intend to identify the effective reliability test criteria for low-cost FCOB technology.

Keywords

delamination; encapsulation; environmental testing; flip-chip devices; integrated circuit packaging; integrated circuit reliability; life testing; thermal stresses; FCOB reliability test; FR4 PCB; HAST; area array solder bumped package; environmental testing; highly accelerated stress test; low-cost flip chip on board technology; reliability test criteria; solder joints; underfill/chip delamination; underfill/substrate delamination; Circuit testing; Delamination; Fatigue; Flip chip; Life estimation; Materials testing; Plastic packaging; Soldering; Stress; System testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on

Conference_Location

Shanghai, China

Print_ISBN

0-7803-8168-8

Type

conf

DOI

10.1109/EPTC.2003.1298766

Filename

1298766