Reliability and new failure modes of encapsulated flip chip on board under thermal shock testing

Author

Bo, Cheng ; Li, Wang ; Qun, Zhang ; Xia, Gao ; Xiaoming, Xie ; Kempe, Wolfgang

Author_Institution

DaimlerChrysler SIM Technol. Co., Ltd, Shanghai, China

fYear

2003

fDate

28-30 Oct. 2003

Firstpage

416

Lastpage

421

Abstract

The thermomechanical reliability of flip chip on board (FCOB) assembly under thermal shock test is addressed in this paper by investigation of different material/process combinations (underfill, flux, reflow atmospheres). It is verified that solder fatigue is the dominate failure mechanism and delamination has obvious adverse effect on the solder joint lifetime. Periodic solder joint crack is first reported in this study and is determined to be related to glass fiber distribution in the PCB.

Keywords

chip-on-board packaging; delamination; fatigue cracks; fatigue testing; flip-chip devices; integrated circuit reliability; reflow soldering; thermal shock; thermal stress cracking; PCB glass fiber distribution; delamination; encapsulated flip chip on board; failure modes; flux; periodic solder joint crack; reflow atmosphere; solder fatigue; thermal shock testing; thermal. shock test; thermomechanical reliability; underfill; Assembly; Atmosphere; Electric shock; Failure analysis; Fatigue; Flip chip; Materials reliability; Materials testing; Soldering; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on

Conference_Location

Shanghai, China

Print_ISBN

0-7803-8168-8

Type

conf

DOI

10.1109/EPTC.2003.1298772

Filename

1298772