DocumentCode
2991017
Title
Reliability analysis in IC package
Author
He, Ping ; Peng, Yaowei ; Gu, Jing ; Wang, Jun ; Yu, Hongkun ; Ni, Jinfeng ; Qian, Ziyong ; Wang, Jiaji
Author_Institution
Dept. of Mater. Sci., Fudan Univ., Shanghai, China
fYear
2003
fDate
28-30 Oct. 2003
Firstpage
460
Lastpage
466
Abstract
In developing IC packaging, the study of failure mechanisms is very important for the production process and the device usage process. Many researchers have made contributions to this field. In this paper, some work related to reliability analysis carried out in Fudan University is reviewed and, in addition, further research topics are discussed.
Keywords
failure analysis; integrated circuit packaging; integrated circuit reliability; IC package reliability analysis; IC packaging; device usage process; failure analysis; failure mechanisms; production process; Capacitive sensors; Delamination; Fatigue; Integrated circuit packaging; Plastics; Production; Soldering; Temperature; Testing; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location
Shanghai, China
Print_ISBN
0-7803-8168-8
Type
conf
DOI
10.1109/EPTC.2003.1298781
Filename
1298781
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