Increased Capacitance Density with Metal-Insulator-Metal - Metal Finger Capacitor (MIM-MFC)

Capacitors are indispensable in mixed signal and RF applications. In mixed signal applications, capacitors and inductors often take up a very large space on the chip as compared to the digital portion of the circuit. In this paper we propose a new configuration of metal-insulator-metal - metal finger capacitor (MIM-MFC) to increase capacitance density. This capacitor is designed to be area effective, thus it is an attractive choice for mixed signal and RF applications. The capacitors were fabricated using Silterra Malaysia´s 180 nm RF CMOS process technology. This paper also provides low frequency characterization measurement data for MIM-MFC. Analysis is made as compared to pure MIM and pure MFC that were fabricated on identical process and measured on the same wafer.