Title :
Electrical Analysis of High Temperature SAW Resonator Packages
Author :
Abadi, Mohammad Hadi Shahrokh ; Hamidon, Mohd Nizar ; Sidek, Roslina ; Malekzadeh, Mina
Author_Institution :
Univ. Putra Malaysia, Serdang
fDate :
Oct. 29 2006-Dec. 1 2006
Abstract :
This paper presents a study on the effects of package types and materials on the performance of high temperature SAW resonator based on GaPO4. Flip chip and wire bond package and interconnection with different materials have been considered. The studied materials for package include GaPO4 and AlN as insulator and Au, Pt, Ni, Au70/Pt30 as conductor. Analysis based on quasi-approximation of FDM shows that the flip chip is favorable for SAW resonator package due to less frequency shift when compared to wire bonding.
Keywords :
electronics packaging; flip-chip devices; gallium compounds; lead bonding; surface acoustic wave resonators; GaPO4; electrical analysis; flip chip; high temperature saw resonator packages; wire bond package; Bonding; Conducting materials; Flip chip; Frequency; Gold; Insulation; Packaging; Surface acoustic waves; Temperature; Wire; AIN: Aluminum Nitride; FDM: Finite Different Method; FEM: Finite Element Method; GaPO4: Gallium Phosphate; HT: High Temperature; IDT: InterDigital Transducer; SAW: Surface Acoustic Wave; TDR: Time Domain Reflectometery;
Conference_Titel :
Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
0-7803-9730-4
Electronic_ISBN :
0-7803-9731-2
DOI :
10.1109/SMELEC.2006.380731
