A study of Ag micro-particle reinforced Sn-Zn matrix composite solder

Author

Das, Sajal K. ; Sharif, Amir

Author_Institution

Dept. of Mater. & Metall. Eng., Bangladesh Univ. of Eng. & Technol., Dhaka, Bangladesh

fYear

2008

fDate

4-6 Nov. 2008

Firstpage

1

Lastpage

6

Abstract

In this work, Ag micro-particles content in the range between 0-4.0 wt.% with Sn-Zn eutectic system, were examined in order to understand the effect of Ag addition on the microstructural and mechanical properties as well as the thermal behavior of the composite solders. The shear strengths and the interfacial reactions of Sn-Zn micro-composite eutectic solders with Au/Ni/Cu ball grid array (BGA) pad metallization were systematically investigated. The three distinct intermetallic compound (IMC) layers were formed at the solder interface of the Au/electrolytic Ni/Cu bond pad with Sn-Zn composite alloys. The more Ag particles added to the Sn-Zn solder, the more Ag-Zn compound formed to thicken the uppermost IMC layer. The dissoluted Ag-Zn IMCs formed in the bulk solder redeposited over the initially formed interfacial Au-Zn IMC layer, prevented the whole IMC layer lift-off from the pad surface. Cross-sectional studies of the interfaces were also conducted to correlate with the fracture surfaces.

Keywords

ball grid arrays; copper alloys; eutectic alloys; gold alloys; metallisation; nickel alloys; shear strength; silver alloys; solders; tin alloys; zinc alloys; Au-Ni-Cu; Sn-Zn-Ag; ball grid array pad metallization; composite alloys; distinct intermetallic compound layer; interfacial reactions; mechanical properties; microcomposite eutectic solders; microparticle reinforced matrix composite solder; microstructural properties; shear strengths; solder interface; thermal behavior; Bonding; Copper; Environmentally friendly manufacturing techniques; Fatigue; Gold; Intermetallic; Lead; Mechanical factors; Surface cracks; Temperature distribution;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International

Conference_Location

Penang

ISSN

1089-8190

Print_ISBN

978-1-4244-3392-6

Electronic_ISBN

1089-8190

Type

conf

DOI

10.1109/IEMT.2008.5507806

Filename

5507806