DocumentCode
2993042
Title
Modification and Modeling of Ni/Si Interface for Photodetector Applications
Author
Hashim, M.R. ; Yusoff, M.Z.M.
Author_Institution
Univ. Sains Malaysia, Penang
fYear
2006
fDate
Oct. 29 2006-Dec. 1 2006
Firstpage
805
Lastpage
810
Abstract
We have demonstrated with both experiment and simulation, the method to modify the current response of n type silicon photodetector. The application of ultra-cooling temperature treatment (77 K) at various cooling times (15-60 minute) has been shown to significantly modify surface properties of n type silicon (100). The surface roughness of the untreated and treated samples was obtained using AFM techniques. Treated Si sample have better surface uniformity than untreated sample. The nickel (Ni) metal contacts were then deposited on the samples followed by current-voltage (I-V) characterisation. Treated samples showed increased dark and light currents compared with untreated sample. However, current gain (ratio of light to dark current) of some of the treated sample is enhanced while some are reduced compared with that of untreated sample. The simulation software ATLAS in SILVACO package is used to describe the effect of Ni/Si interface properties on its photodetection.
Keywords
atomic force microscopy; electric current; elemental semiconductors; metal-semiconductor-metal structures; nickel; photodetectors; semiconductor device models; silicon; surface roughness; thermal analysis; AFM techniques; Ni-Si; SILVACO package; current gain; current response; current-voltage characterisation; interface properties; n type silicon photodetector; nickel metal contacts; simulation software ATLAS; surface properties; surface roughness; temperature 77 K; time 15 min to 60 min; ultra-cooling temperature treatment; Cooling; Dark current; Nickel; Photodetectors; Rough surfaces; Silicon; Software packages; Surface roughness; Surface treatment; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on
Conference_Location
Kuala Lumpur
Print_ISBN
0-7803-9730-4
Electronic_ISBN
0-7803-9731-2
Type
conf
DOI
10.1109/SMELEC.2006.380748
Filename
4266731
Link To Document