• DocumentCode
    2995202
  • Title

    A Method of Crack Defects Real-Time Image Enhancement in Continuous Casting Billet

  • Author

    Qiu, Xuanbing ; Li, Gang ; Wei, Jilin ; Wei, Cao

  • Author_Institution
    Dept. of Phys., Taiyuan Univ. of Sci. & Technol., Taiyuan, China
  • fYear
    2012
  • fDate
    21-23 May 2012
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    In the embedded image detection of continuous casting billet defects, the image enhancement of crack is an important criterion in the subsequent recognition. The effect of image enhancement, especially the real-time of image enhancement, decides whether the system can be adopted or not. Based on the dual-core OMAP3530, we set up an embedded real-time online testing hardware device. Taking the system´s real-time and the environmental noise of the high-temperature scene into account, the billet image, obtained by the CCD sensor, is simply and effectively enhanced by going through the Laplacian sharpening and the Histogram equalization. Matlab simulation analysis improves the Contrast Improvement Index (CII) of image and cuts down the simulating time; and it provides a powerful precondition for the subsequently billet defects real-time identification by DSP hardware.
  • Keywords
    CCD image sensors; automatic test equipment; billets; casting; cracks; digital signal processing chips; image enhancement; image recognition; object detection; production engineering computing; statistical analysis; CCD sensor; DSP hardware; Laplacian sharpening; Matlab simulation analysis; OMAP3530 dual-core; charge-coupled device; continuous casting billet; contrast improvement index; crack defect; defect realtime image enhancement; digital signal processor; embedded image detection; embedded realtime online testing hardware device; histogram equalization; image recognition; simulation time; Billets; Charge coupled devices; Histograms; Image enhancement; Indexes; Laplace equations; Real time systems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photonics and Optoelectronics (SOPO), 2012 Symposium on
  • Conference_Location
    Shanghai
  • ISSN
    2156-8464
  • Print_ISBN
    978-1-4577-0909-8
  • Type

    conf

  • DOI
    10.1109/SOPO.2012.6270558
  • Filename
    6270558