• DocumentCode
    2995292
  • Title

    High-level synthesis under multi-cycle interconnect delay

  • Author

    Jeon, Jinhwan ; Kim, Daehong ; Shin, Dongwan ; Choi, Kiyoung

  • Author_Institution
    Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., South Korea
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    662
  • Lastpage
    667
  • Abstract
    As process technology goes into deep submicron range, interconnect delay becomes dominant among overall system delay, occupying most of the system clock cycle time. Interconnect delay is now a crucial factor that needs to be considered even during high-level synthesis. In this paper, we propose a concurrent scheduling and binding algorithm that takes interconnect delay into account. We first define our distributed target architecture, which minimizes the effect of interconnect delay on clock cycle time. We no longer assume that interconnect delay between functional units is a part of one clock cycle, interconnect delay can span over multiple clock cycles. We incorporate the concept of multi-cycle interconnect delay into scheduling and binding process, to reduce the critical path length and therefore the system latency. We show that by introducing interconnect delay, we can obtain latency improvement of up to 54% and of 37% on the average
  • Keywords
    delays; high level synthesis; integrated circuit interconnections; binding algorithm; clock cycle time; concurrent algorithm; critical path length; deep submicron process technology; digital IC design; distributed target architecture; high-level synthesis; multi-cycle interconnect delay; scheduling algorithm; system latency; Clocks; Computer architecture; Delay effects; Delay systems; Geometry; High level synthesis; Inductance; Logic; Noise generators; Scheduling algorithm;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2001. Proceedings of the ASP-DAC 2001. Asia and South Pacific
  • Conference_Location
    Yokohama
  • Print_ISBN
    0-7803-6633-6
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2001.913385
  • Filename
    913385