Title :
Stress grading in integrated power modules
Author :
Duchesne, C. ; Lebey, T. ; Guyennet, M. Mermet ; Dutarde, E. ; Dagdag, S.
Author_Institution :
Power Electron. Associated Res. Lab., Semeac
Abstract :
Power electronics packaging, like integrated power modules, constitute an advanced technology leading to power density increase, weight and volume decrease and enhancing the reliability level. However, the continuous increase of the voltage lead to questions regarding power device environment. We discuss in the following different solutions able to achieve the electric stress gradation.
Keywords :
electronics packaging; permittivity; power electronics; reliability; integrated power modules; permittivity; power electronics packaging; reliability; stress grading; Conductivity; Dielectrics and electrical insulation; Electronics packaging; Metallization; Multichip modules; Permittivity; Power electronics; Semiconductor materials; Stress; Voltage;
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2007. CEIDP 2007. Annual Report - Conference on
Conference_Location :
Vancouver, BC
Print_ISBN :
978-1-4244-1482-6
Electronic_ISBN :
978-1-4244-1482-6
DOI :
10.1109/CEIDP.2007.4451480
