DocumentCode :
2995661
Title :
Mechanical property measurements of thin films using load-deflection of composite rectangular membrane
Author :
Tabata, Osamu ; Kawahata, Ken ; Sugiyama, Susumu ; Igarashi, Isemi
Author_Institution :
Toyota Central Res. & Dev. Lab. Inc., Aichi, Japan
fYear :
1989
fDate :
20-22 Feb 1989
Firstpage :
152
Lastpage :
156
Abstract :
The internal stress and Young´s modulus of thin films are determined by measuring the deflection versus pressure of the rectangular membranes of materials. In order to reduce the measurement error for the Young´s modulus due to an unknown Poisson´s ratio, a 2 mm×8 mm rectangular membrane is adopted. Measurements are made by using a computerized measurement system. Low-pressure chemical-vapor-deposited (LPCVD) silicon nitride films are characterized and found to have an internal stress of 1.0 GPa and a Young´s modulus of 290 GPa. By using this composite membrane technique, an LPCVD polysilicon film and a plasma-CVD silicon nitride film are characterized. The internal stress and Young´s modulus were found to be -0.18 GPa and 160 GPa for the LPCVD polysilicon film and 0.11 GPa and 210 GPa for the plasma-CVD silicon nitride film
Keywords :
Young´s modulus; automatic test equipment; elastic moduli measurement; internal stresses; materials testing; measurement by laser beam; mechanical variables measurement; stress measurement; thin films; LPCVD films; Si3N4; Young´s modulus; chemical-vapor-deposited; composite rectangular membrane; computerized measurement system; internal stress; laser techniques; load-deflection; measurement error; mechanical property measurement; plasma CVD films; polycrystalline Si; thin films; Biomembranes; Internal stresses; Mechanical factors; Mechanical variables measurement; Plasma measurements; Pressure measurement; Semiconductor films; Silicon; Stress measurement; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 1989, Proceedings, An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots. IEEE
Conference_Location :
Salt Lake City, UT
Type :
conf
DOI :
10.1109/MEMSYS.1989.77981
Filename :
77981
Link To Document :
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