• DocumentCode
    2996732
  • Title

    OFF stage leakage analysis from Power Gating application in deep sub-micron technology

  • Author

    Lee Kee Yong

  • Author_Institution
    Intel Microelectron., Bayan Lepas, Malaysia
  • fYear
    2009
  • fDate
    15-16 July 2009
  • Firstpage
    199
  • Lastpage
    202
  • Abstract
    It is ubiquitous that high performance integrated circuits designs are commonly suffers from total chip power consumption. Moreover, when we are marching towards deeper sub-micron technology from process scaling, the transistor leakage it self had became more and more dominant to the total component power which is unavoidable. Clever employment of power gating / sleep transistor / MTCMOS technology can help to shut off leakage power from un-use blocks. However at high temperature and fast skew, OFF stage leakage current will still be very significant if wrong implementation strategy was employed. This paper described the circuit analysis, optimization strategies and design methodology to tackle this issue head on. Details break down on the circuit modeling and design trade off on Power Gating FETs was described in this paper including simulation results and equations to aid the illustrations. The OFF stage power saving using MTCMOS was re-evaluated for total leakage minimization.
  • Keywords
    logic circuits; network analysis; optimisation; power field effect transistors; OFF stage leakage analysis; OFF stage power saving; circuit analysis; circuit modelling; deep submicron technology; optimization analysis; power gating FET; power gating application; total leakage minimization; Circuit analysis; Design methodology; Design optimization; Employment; Energy consumption; FETs; Integrated circuit synthesis; Integrated circuit technology; Leakage current; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design, 2009. ASQED 2009. 1st Asia Symposium on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    978-1-4244-4952-1
  • Electronic_ISBN
    978-1-4244-4952-1
  • Type

    conf

  • DOI
    10.1109/ASQED.2009.5206270
  • Filename
    5206270