DocumentCode :
2998204
Title :
Thermal and viscoelastic characterization of transfer-molded epoxy encapsulant during simulated post-mold cure
Author :
Chew, Spencer
Author_Institution :
Inst. of Microelectron., Singapore
fYear :
1996
fDate :
28-31 May 1996
Firstpage :
1032
Lastpage :
1038
Abstract :
This paper describes the characterization of epoxy mold compound by subjecting transfer-molded encapsulants to a temperature programme simulating post-mold cure using thermomechanical analysis and dynamic mechanical analysis. The real-time change in dimension and viscoelastic properties of the epoxy encapsulant during an experimental post-mold cure process is measured. Results show evidence of residual cure shrinkage and flexural storage modulus growth occuring during experimental post-mold cure; sharp initially but stabilize subsequently. A minimum post-mold cure duration is recommended in order to ensure optimum dimensional and mechanical stability of the epoxy encapsulant
Keywords :
encapsulation; integrated circuit packaging; plastic packaging; shrinkage; viscoelasticity; cure duration; dynamic mechanical analysis; flexural storage modulus growth; post-mold cure process; residual cure shrinkage; simulated post-mold cure; temperature programme; thermal characterization; thermomechanical analysis; transfer-molded epoxy encapsulant; viscoelastic characterization; Analytical models; Elasticity; Epoxy resins; Mechanical factors; Packaging; Plastics; Polymers; Temperature; Thermomechanical processes; Viscosity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location :
Orlando, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-3286-5
Type :
conf
DOI :
10.1109/ECTC.1996.550809
Filename :
550809
Link To Document :
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