Title :
13th International Workshop on THERMal INvestigation of ICs and systems
Abstract :
The following topics are dealt with: 3D stacked packaging; transient thermal characterization; solder joints reliability; microscale cooling; compact modeling theory; cooling technologies; experimental analysis; thermal management; thermal resistance; high power LEDs; multi-physics simulation and package reliability.
Keywords :
cooling; integrated circuit modelling; light emitting diodes; reliability; thermal management (packaging); 3D stacked packaging; compact modeling theory; cooling technologies; experimental analysis; high power LED; microscale cooling; multi-physics simulation; package reliability; solder joints reliability; thermal management; thermal resistance; transient thermal characterization;
Conference_Titel :
Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
Conference_Location :
Budapest
Print_ISBN :
978-2-35500-002-7
DOI :
10.1109/THERMINIC.2007.4451731
